Continuing with the growth already seen in the Asia-Pacific and Europe, the Las Vegas facility will expand TES’s overall processing capacity and deliver a full suite of IT Asset Disposition services to support the technology giants on the West Coast.
TES, a global leader in sustainable IT asset disposition (ITAD) and IT lifecycle management services, announced the opening of a new 40,000-square-foot facility in Las Vegas in January 2023. This facility expands TES's processing capacity and offers a full suite of IT Asset Disposition services to support the large community of technology companies on the West Coast.
The Las Vegas facility will provide onsite data destruction, data center decommissioning, and the redeployment or resale of parts and assets. Additional services include testing, grading, repairing, refurbishment, and recycling. This facility will complement TES's existing infrastructure and will bring TES's investment to almost $10 million in ITAD infrastructure across its North American facilities over the previous five years.
Additionally, TES has been named as a Representative Vendor in Gartner® 2023 Market Guide for IT Asset Disposition.
TES's infrastructure comprises over 43 facilities across more than 22 countries. The latest facility is strategically located near Las Vegas's major logistics arteries, reducing costs and carbon emissions from excess transportation.
Eric Ingebretsen, TES’s Chief Commercial Officer, commented: “We are committed to providing sustainable and efficient IT lifecycle solutions that not only meet our clients' needs but also contribute to a healthier planet. Our new Las Vegas facility echoes that commitment, providing best-in-class IT asset disposition services that align with our clients' data and information security needs.”
The Las Vegas facility was purpose-built and is designed to meet complex compliance needs while removing the associated barriers to organizations leveraging a strategic ITAD program.
Source: Gartner, Market Guide for IT Asset Disposition, Rob Schafer et al., 23 January 2023
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